JPH0452948Y2 - - Google Patents
Info
- Publication number
- JPH0452948Y2 JPH0452948Y2 JP1989035232U JP3523289U JPH0452948Y2 JP H0452948 Y2 JPH0452948 Y2 JP H0452948Y2 JP 1989035232 U JP1989035232 U JP 1989035232U JP 3523289 U JP3523289 U JP 3523289U JP H0452948 Y2 JPH0452948 Y2 JP H0452948Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- shielding plate
- housing body
- heat
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000005476 soldering Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 description 22
- 239000003779 heat-resistant material Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989035232U JPH0452948Y2 (en]) | 1989-03-28 | 1989-03-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989035232U JPH0452948Y2 (en]) | 1989-03-28 | 1989-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02126383U JPH02126383U (en]) | 1990-10-18 |
JPH0452948Y2 true JPH0452948Y2 (en]) | 1992-12-11 |
Family
ID=31540410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989035232U Expired JPH0452948Y2 (en]) | 1989-03-28 | 1989-03-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0452948Y2 (en]) |
-
1989
- 1989-03-28 JP JP1989035232U patent/JPH0452948Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH02126383U (en]) | 1990-10-18 |
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